Aachen, September 19, 2023 – At FAKUMA in Friedrichshafen (October 17-21, 2023), SIGMA Engineering GmbH will present an example from /H&B/ ELECTRONIC created with SIGMASOFT® in Hall A5, Booth 5110. The project demonstrates how the development of conformal cooling for a connector housing is enabled and optimized through simulation.
Fundamentally, in injection molding, part quality and cycle time are significantly influenced by the thermal performance of the mold. Temperature variations lead to different cooling rates and result in residual stresses and warping in the finished part. Variations in wall thickness within the part are problematic as localized cooling requirements differ greatly. The goal is to keep temperature as homogeneous as possible, ensuring even heat dissipation. Here, conformal cooling is increasingly being utilized. Simulation allows for quantifying the advantages compared to conventional concepts (improved part quality, shorter cycle time, accurate prediction of hotspots, etc.) beforehand, in order to weigh them against additional costs.