Aachen, May 8th 2023– At the Moulding Expo 2023 in Stuttgart (June 13-16, 2023), SIGMA Engineering GmbH presents at booth 1E18 insights into mold simulation and the simulative design of tempering systems using SIGMASOFT®. Simulation is critical to project success in plastics processing, including tooling, where geometries, gating position, and process design can already be optimized. /H&B/ ELECTRONIC relies on SIGMASOFT® for the design and dimensioning of temperature control channels.
Cooling is critical to the quality of thermoplastic components. Temperature differences lead to different cooling rates and create residual stresses and warpage in the finished component. This becomes problematic when there are differences in wall thickness within the component, as the cooling requirements are highly variable locally. Conformal cooling, meanwhile, is an established concept in tooling that is increasingly being used. Simulation allows the cost of conformal cooling to be evaluated in advance against the advantages of the conventional concept (improved component quality, shorter cycle times, etc.).